Packaging Engineers provide project management, package design and/or development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units.

Job Description:

Responsible for the thermal and/or mechanical and/or electrical design, analysis, and development of electronic packages.

Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design.

Conducts tests and research on basic materials and properties.

Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance.

Provides consultation concerning packaging problems and improvements in the packaging process.

Responds to customer and/or client requests or events as they occur.

Develops solutions to problems utilizing formal education and judgment.

Qualifications

You must possess the below requirements to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences.

Requirements:

Master’s degree or PhD degree in Mechanical Engineering or Chemical Engineering or Materials Engineering or equivalent and 6+ month’s experience.

Preferred:

2 years’ experience

Direct experience in related technology process development (or equivalent) is desirable.